![]() ![]() The results showed that the material removal rate saw a nonlinear increasing trend with the increase in particle sizes, while the surface roughness showed an approximately linear increase. Moreover, the potential energy, cutting force, and temperature in the Newtonian zone between the sapphire crystal atoms also increased. The simulation results show that the abrasive particle radius was 12 Å, the micro-cutting force reached more than 3500 nN, while the cutting force with an abrasive particle radius of 8 Å only reached 1000 nN. The effect of different abrasive particle sizes on material removal was analyzed through experiments. Molecular dynamics were used to simulate the effects of abrasive particle size on the cutting force, potential energy, and temperature in the Newtonian zone during micro-cutting. Aiming at exploring the material removal mechanism for sapphire using diamond abrasive grains at the microscopic level, this paper modeled and analyzed the microscopic yield behavior of diamond abrasive grains in the FAP grinding process of sapphire. ![]()
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